Hitachi Announces Broad Family of Ultra-Thin Hard Drives

From X-bit Labs: Hitachi Global Storage Technologies (Hitachi GST) on Wednesday announced the industry’s broadest family of ultra slim and light 7mm z-height drives. With a broad the new Hitachi Z-series family of Travelstar and CinemaStar drives in capacities up to 320GB, Hitachi is at the forefront of the shift from 9.5mm 2.5” drives to 7mm 2.5” drives across a broad range of market segments.

“We are putting the full weight and force of our R&D, manufacturing, distribution and marketing behind our one-disk 7mm drives such that we can lead the category and demonstrate that we have the most complete, robust and flexible offerings in this rapidly emerging category,” said Brendan Collins, vice president of marketing at Hitachi GST.

Hitachi Z-series of hard drives consists of different models with 160GB, 250GB or 320GB capacities, which are optimized for different thin and light applications:

* Travelstar Z7K320: 7200rpm spindle speed, 16MB buffer, typical average seek time 13ms, Serial ATA-300 interface, 0.8W low power idle power consumption, 1.8W active power consumption. The 7ZK320 delivers up to 18% better application performance than 5400 RPM models of the same capacity;
* Travelstar Z5K320: 5400rpm spindle speed, 8MB buffer, typical average seek time 13ms, Serial ATA-300 interface, 0.55W low power idle power consumption, 1.6W active power consumption. The Z5K320 is optimized for quiet and low-power operation;
* Cinemastar Z5K320: 5400rpm spindle speed, 8MB buffer, typical average seek time 15ms, Serial ATA-300 interface, 0.55W low power idle power consumption, 1.4W active power consumption. The Cinemastar models have been customized to support digital video and surveillance applications and feature Hitachi SmoothStream technology that supports the ATA-7 streaming command set, and SCT provides time-limited error recovery and thermal monitoring capabilities.

All Hitachi Z-series drives feature common connectors and common mounting points for simple integration into existing systems, and enable greater design flexibility to differentiate and meet market demands for new, thinner, lighter and more robust devices.

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