Intel, Micron Introduce 25nm NAND Flash Production

From PC World: 2010 will go down as the year flash storage goes mainstream. Intel-Micron Flash Technologies -- a Lehi, Utah-based joint venture from the two companies that's been sharing technology and flash production since 2005 -- has unveiled its 25 nanometer flash production process. And the impact on consumer products will be immediately noticeable as the flash makes its way to products. (Click on the image to enlarge it; it shows an Intel-Micron 25-nanometer (nm) 8 gigabyte (8GB) NAND flash memory device, which measures 167mm2 and is the smallest, most advanced process technology in the semiconductor industry.)

IMFT says flash manufacturing is on a 12- to 15-month refresh cycle. The 25nm process represents fourth-generation technology. Back in 2006, the process technology was at 72nm, 2008 was at 50nm, and last year, with the introduction of Intel's X25-M, it dropped to 34nm.

The improved manufacturing efficiencies will translate into clearly tangible benefits for consumers once production ramps up to full volume in the second quarter (today's announcement indicates IMFT has completed sampling to customers). Neither Intel nor Micron has formally announced product, but both companies indicated we can expect to see the new flash in products "later this year." Previously, it's been reported that Intel will refresh its solid-state drive (SSD) line in the fourth quarter.

With 24nm flash, IMFT will be able to produce 2-bits-per-cell MLC NAND flash, with 8GB of storage on a single 167mm flash die. That's twice the capacity the previous 34nm process could produce, and it eliminates the need for IMFT's previously announced 3-bit-per-cell MLC flash, which increased capacity by increasing the bits-per-cell, but keeping the same 32nm process. For perspective, 167mm is small enough to fit through a CD's hole, and yet it packs more than ten times the data capacity.

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