Samsung Begins to Ship Consumer Memory Modules with 30nm DRAM

From X-bit Labs: Samsung Electronics, the largest maker of dynamic random access memory (DRAM) in the world, said Thursday that it had begun shipping consumer-class memory modules featuring DDR3 DRAM chips produced using 30nm-class process technology. The new modules are more energy-efficient and potentially have higher overclocking potential.

Samsung’s new DDR3 DRAM modules are available in 2GB and 4GB capacities in very low profile (VLP) unbuffered dual in-line memory module (UDIMM) configurations for desktop PCs, and small outline DIMM (SODIMM) configurations for notebook PCs. The new modules transfer data at up to 1600MHz clock-speed, but it is unclear at what voltages and with what latency settings.

Samsung usually does not sell its memory modules through distribution channels on its own. There is a number of companies, who acquire such devices and then sell them under their own trademarks. As a result, shortly, overclocking-class modules with speeds of 1866MHz and upwards based on Samsung's 30nm DRAMs may emerge in the retain, provided that the chips can actually handle high clock-speeds.

“Samsung is committed to bringing performance-enhanced computing to consumers, and our 30nm-class process technology offers an outstanding combination of advanced low-power DDR3 technology, with blazing speed up to 1600 megabits per second," said Reid Sullivan, senior vice president of mobile entertainment marketing at Samsung Electronics America.

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