From Tom's Hardware: Although TSMC's revenue in the second quarter dropped by 10% year-over-year, the company is quite optimistic about the rebound of the semiconductor sector in the coming years. This is why it announced its intention to construct a new advanced chip packaging plant that will cost $2.87 billion and be located in Tongluo Science Park. In addition, the company is expected to formally announce its German fab in the coming weeks, according to CNA.
"To meet market needs, TSMC is planning to establish an advanced packaging fab in the Tongluo Science Park," a statement by TSMC reads. "TSMC expects to invest nearly NT$90 billion for the project, and create 1,500 job opportunities. The Science Park Administration has officially agreed to TSMC's application to lease land at the Tongluo Science Park and is arranging for a lease briefing."
This plan for an additional advanced packaging facility is still in its preliminary phase, and TSMC has yet to hold a groundbreaking ceremony. Taiwanese media speculates that the facility may be up and running in 2027, so it is too early to discuss production capacity and other details.
View: Full Article
