From Tom's Hardware: AMD still has to introduce its codenamed Strix Halo processor for ultra-high-performance laptops, but we occasionally get confirmations about this APU's monstrous specifications. This week, an unknown blogger posted excerpts allegedly from AMD documents revealing some extra details about AMD's upcoming processor.
The leaked excerpts claim that AMD's Strix Halo will reportedly come in an ultra-large package with a 256-bit LPDDR5X memory interface. One of the slides indicates that AMD's Strix Halo will come in a 37.5 mm × 45 mm package called FP11, precisely the size of an Intel processor in an LGA1700 form factor.
That package is said to house either a multi-chiplet processor featuring two eight-core Zen 5 core complex dies (CCDs) and a gigantic companion chiplet containing a high-end GPU, a memory controller with a 256-bit LPDDR5X-8533 PHY (up to 273 GB/s of peak bandwidth), and I/O capabilities; or an even a more gargantuan monolithic system-on-chip (SoC).
Based on the blueprint, the CCD could feature a die size of 66.34 mm², while the IOD+GPU could be 307.26 mm² large. If this is a monolithic SoC, which we doubt, it would have a die size of 460.9 mm².
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