From X-bit Labs: While the next-generation high-end desktop (HEDT) family of chips is several quarters away, the first pictures of the Intel Core i7 Extreme “Haswell-E” central processing unit has already been published. This confirms that the new products have already reached Intel’s partners who are about to start testing the new chips and design their PCs for the second half of next year.
The engineering sample of what is claimed to be code-named Haswell-E processor does not look like an extraordinary chip. It features eight cores, runs at 3.0GHz and was assembled in the U.S. Most likely, it features eight x86 cores, reports VR-Zone web-site. Besides, it has a new heat-spreader that covers parts of the processor’s substrate as well. It is unclear whether this was made to make the chip more suitable for advanced cooling system, or certain components on the substrate needs additional cooling.
The next year’s enthusiast desktop platform will pack a number of firsts and will naturally bring a significant performance boost over regular desktop platforms as well as over existing and incoming HEDT solutions based on code-named Ivy Bridge-E processor. Intel Core i7 “Haswell-E” central processing units will pack six or eight x86 cores with Haswell micro-architecture and Hyper-Threading technology, 20MB of L3 cache, quad-channel DDR4 memory controller (2133MHz maximum clock-speed, up to one DIMM per channel) as well as Turbo Boost 2 technology. The processors will traditionally have 40 integrated PCI Express 3.0 lanes, but will lack built-in graphics adapter, which is logical.
The forthcoming enthusiast-class desktop platform will rely on code-named Wellsburg chipset and will use all-new LGA2011-3 socket. Interestingly, the new microprocessors will have up to 140W thermal design power, which points to high clock-rate in addition to high core-count. Besides, traditionally Intel will unlock all multipliers on HEDT platform to allow maximum level of customization.
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