Imec, GlobalFoundries and Qualcomm Team Up for High-Density STT-MRAM

From X-bit Labs: Imec, GlobalFoundries and Qualcomm announced on Tuesday that they have expanded joint development efforts to advance STT-MRAM [spin-transfer torque magnetoresistive random access memory] technology. The collaboration seems to be important as it not only demonstrates Qualcomm’s interest towards STT-MRAM, but also brings together a leading fabless chip designer and a leading contract chipmaker.

"We are elated to intensify our collaboration with GlobalFoundries and the other program members on advanced memory technologies—a true testament to the value we offer our industrial partners," stated Luc Van den hove, president and CEO at imec.

The first IC manufacturer to join imec's R&D program on emerging memory technologies, GlobalFoundries completes the value chain of imec's research platform, which fuels industry collaboration from technology up to the system level. GlobalFoundries is joining a team with Qualcomm and several worldwide equipment suppliers providing the complete infrastructure necessary for R&D on STT-MRAM.

"Our unique research environment harnesses the collective expertise and knowledge of the entire value chain, bringing together foundries, IDMs, fabless and fablite companies, packaging and assembly companies, and equipment and material suppliers to drive innovation and the development of new, competitive products,” added Mr. Van den hove.

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