From PC Mag: Intel's latest advancement in chip-making is focused on packing the silicon together to create a lean, power-efficient PC.
On Wednesday, the company debuted a new manufacturing technology called "Foveros" that overhauls a PC's internal guts by fabricating the microprocessors on top of each other.
No longer does all the silicon need to be laid out on a flat board; space can be saved by bringing the chip manufacturing to the third-dimension and laying out one processor on another in stacks.
3D chip packaging tech is already used to cram memory chips together. But Intel said its latest manufacturing advancement can for the first time bring the 3D stacking to microprocessors such as CPUs, graphics chips, and AI processors.
The chip stacking can not only save on space, but also reduce power. One processor no longer needs to communicate with another over the long copper wires on the circuit board; instead the processors can be laid on top of each other, reducing the communication distance.
"It will enable the combination of world-class performance and power efficiency in a small form factor," Intel told PCMag in a statement.
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