First Intel-branded 3G, 4G chips debut

From CNET News.com: ntel announced shipments of the first 3G chips--and future 4G silicon--that sport its branding today at Mobile World Congress--the fruits of its acquisition of Infineon's wireless business.

"Intel Inside" takes on a new meaning with 3G chips. After the acquisition, Intel Mobile Communications has overnight become a major supplier of so-called baseband processors, which handle the 3G connection and are one of the most critical chips in a smartphone or tablet.

Intel's--formerly Infineon's--3G chips are used in prominent devices such as the iPhone and iPad.

Announced today, the XMM 6260 is designed for smartphones and can be coupled with a smartphone's application processor or offered as a standalone solution for PC modems and data cards, Intel said.

The HSPA+ technology "comprises a fully integrated HSPA+ system solution supporting HSPA category 14 (21 megabits per second) in the downlink and category 7 (11.5Mbps) in the uplink," according to Intel.

Intel's MWC wireless rollouts don't stop there. The world's largest chipmaker also announced LTE technology, generically referred to as 4G.

The multimode (LTE/3G/2G) platform XMM 7060 "is suitable for integration in LTE-enabled portable devices such as mobile handsets, data cards/dongles and other embedded solutions," Intel said.

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