TSMC 'Super Carrier' CoWoS interposer gets bigger
From Tom's Hardware: TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory stacks in 2027, the company announced at its European Open Innovation Platform (OIP)...