Page 3 - Physical Look - Inside
As always, we opened up our FSP MEGA TI 1650W power supply to take a detailed look at what is going on inside. Please note that doing this at home may void your 10-year warranty, thanks to the warranty seal FSP applied over one of the attachment screws. Either way, for the benefit of you, we cracked ours open, so you do not need to. There are no user serviceable parts inside.
Disassembling the FSP MEGA TI 1650W was straightforward with the removal of four screws. All of the screws are hex screws, which many people do not have a screwdriver for. Of course, we have all the tools here at APH Networks. Taking out the internal components from the enclosure requires the removal of more screws, which are a mix of hex and standard Philips head screws.
Our photo above shows an overhead view of its internal components. Its OEM is, unsurprisingly, FSP themselves. One highlight of the FSP MEGA TI 1650W, like many power supplies from the company, is the inside has a conformal coating against dust, stains, and humidity for reliable operation harsh environments. It features an LLC full bridge topology with DC-to-DC converters. At first glance, the build quality appears to be excellent. There are four small heatsinks inside. Two of them are partially painted black on the primary side, and two are in their original aluminum finish on the secondary side.
Pulling the enclosure apart and we got straight to the internal inspection. The transient filter stage is the first input stage of a computer power supply, so we will take a look at that first. FSP has always done a great job in the past to make sure their power supplies met or exceeded the recommended requirements in the past, and the MEGA TI 1650W is no exception. The FSP MEGA TI 1650W has one metal oxide varistor, two metalized polyester X-capacitors, four ceramic Y-capacitors, and two ferrite coils. This is two times the amount of X and Y capacitors than recommended.
The active PFC circuit featured on the FSP MEGA TI 1650W is a bridgeless boost interleaved design. A bridgeless boost interleaved design is more of a traditional approach for maximum efficiency, but more exotic designs nowadays feature bridgeless totem-pole PFC thanks to new semiconductor materials for power switches. Eight CET-MOS CEL68N60SF rectifier MOSFETs are used, located on a vertical PCB. Each is certified for up to 43A at 100c, maximum resistance of 37 mΩ, and typical resistance of 31 mΩ at 25c. This on characteristic is called Static Drain-Source On-Resistance, or commonly abbreviated as RDS(on). The more efficient the component is, the lower the RDS(on) value, since it wastes less power with lower resistance.
Further down the line, on the pair of heatsinks next to the bulk capacitors, we can spot four Infineon IPA60R120C7 power transistors, with two on each heatsink. Each is certified for up to 7A at 100c. These transistors present a maximum resistance of 120 mΩ and typical resistance of 103 mΩ when turned on according to the manufacturer's data sheet. An Infineon IDH10G65C6 boost diode is next to each pair of APFC MOSFETs, with one on each heatsink. Four Cmsemicon CMS6047B MOFSETs, with two on each of the vertical add-in PCBs between the APFC heatsinks and rear daughterboard, are used as the main switchers on the MEGA TI 1650W power supply. A pair of Texas Instruments UCC21520 IC drivers are found on the same board.
On the primary side, we can see three Japanese brand Nippon Chemi-Con capacitors. Japanese brand bulk capacitors are specified on the marketing material, so this is to be expected. Our 1650W version of FSP's MEGA TI series power supply incorporates three capacitors, all 560µF x 450V, in parallel for a total of 1680µF capacitance. They are rated at 105c, whereas more value-oriented power supplies usually use 85c rated capacitors.
On the secondary side, we can see more Nippon Chemi-Con and Rubycon capacitors rated at 105c. All rectifiers produce the +12V out, while the +5V and +3.3V outputs are generated from the +12V output using a DC-to-DC converter within as with modern high efficiency power supplies. Six Infineon BSC0902NS MOSFETs are responsible for generating the +5V and +3.3V outputs, located on the vertical board perpendicular to the rear connector board. The BSC0902NS's rated continuous drain current is 67A at 10V, 100c. It has an RDS(on) value of 2.6 mΩ maximum and 2.2 mΩ typical at 10V, 25c. Meanwhile, a Weltrend WT7527 monitoring IC provides over/under current and over/under voltage protection, and the fan is controlled by an ANPEC APW9010 chip, all found on the same PCB.
Twelve Cmsemicon CMR009N04NS power MOSFETs are responsible for generating the +12V output, located at the bottom of the main board. A Champion CM6901T2X SLS, SRC/LLC + SR resonant controller can be spotted here as well, along with a Texas Instrument UCC28070 APFC controller. The datasheets for all components mentioned in this review can be found on their respective manufacturer's websites.
At the very back, we have a large daughterboard covering the entire rear panel for the modular cable sockets. All connection points are soldered directly to the add-on PCB after the secondary stage to reduce power transmission loss compared to having wires. The output connector configuration can be seen on the previous page.
Overall, the internal build quality of FSP's MEGA TI 1650W is excellent. Components are arranged very well for optimal cooling with practically no wires running around inside, and solder points on its black PCB is quite clean in general. I would say the FSP MEGA TI 1650W is generally excellent with regards to the selection of components used under the hood, appropriate for its performance class.
Lastly, we see a 135mm fan that provides cooling to the FSP MEGA TI 1650W's internal components. It is connected to the controller using a 2-pin connector. A 135mm fan is only marginally smaller than the 140mm maximum you can fit in an ATX power supply, and it is beneficial in most cases in providing lots of airflow at lower speeds for quiet operation.
The fan is a Protechnic Electric MGA13512XF-A25, as shown in our photo above. The MGA13512XF-A25 is a fluid dynamic bearing fan with a specified at 0.38A for a maximum speed of 2300 RPM. The fan is not supposed to activate until the PSU is loaded up to 40% in Eco Mode. As such, it should remain off during normal operation, and even when it is on, FSP uses a silent speed profile, so noise is not going to be a problem at all. Fans with fluid dynamic bearings generally have much longer lifespans compared to sleeve bearing fans, and are quite suitable for this application.
Page Index
1. Introduction, Packaging, Specifications
2. Physical Look - Outside
3. Physical Look - Inside
4. Minor Tests and Conclusion
