Page 2 - Physical Look - Outside
Like many Thermaltake cases, cooling performance is the focus here and the Thermaltake CTE C750 TG ARGB Snow is designed to provide smooth airflow throughout the interior. For context, CTE stands for "centralized thermal efficiency", which is the idea of keeping the core components cool with its airflow by having these components near air sources. The outer design has no curves, being very straight-edged and boxy. The white color is consistent throughout the entire outside of the chassis aside from the side of the front panel at the bottom, which contains the Thermaltake logo in black. The front panel behind the tempered glass employs a partial mesh design to allow for intake airflow and to let the RGB LED lighting of any front fan shine through. A smaller tempered glass panel is placed on the front as well, although there are gaps on both sides of the glass at the front so airflow is still possible.
This case contains tempered glass on the left side, which many of you should be familiar with. With measurements coming in at 599.2mm depth, 327mm width, and 565.2mm height, the CTE C750 TG ARGB Snow is larger than your average ATX case, specifically when compared to more average-sized cases like the Antec DF800 FLUX and Cooler Master MasterBox MB600L V2. The CTE C750 TG ARGB Snow weighs in at 17.1kg, which is also heavier than your average mid-tower unit.
At the top of the case, we can see the I/O panel, which is located on the eastern edge. Going from left to right, we have a semi dome-shaped power button, storage and power LED indicators, four USB 3.0 Type-A ports, a single USB Type-C Port, 3.5mm headphone jack, 3.5mm microphone jack, and a reset switch. I really like that the design employs four USB 3.0 Type-A ports, although this means you will need two USB Type 3.0 headers internally. I also respect the inclusion of a USB Type-C cable, although this should be expected in the year 2023.
Due to the unique nature of this case, the back of this chassis is different than your average mid-sized tower. A pre-installed 140mm fan is mounted at the top right, visible behind the panel. The mesh panel covers majority of the back to allow airflow for all the fans that can fit. There is a slot for all the cables to fit in as well just above the power supply hole. You will probably notice that there is no motherboard opening where you may expect one. This is due to the cables being routed from the back to the top, which will be covered in the next page.
Two sets of large feet can be seen at the bottom of the case. There is a small pad in the middle of each feet designed to reduce vibration. Measuring approximately 6.5cm in width and 2.5cm in length though, I feel that there is only so much vibration that they would realistically reduce at such a small size. The feet are also removable with three Phillips head screws per two feet. The feet raise the case about 2.6cm above the ground. A large removable dust filter can be seen at the bottom. This dust filter will help maintain clean airflow for your system. I am also happy to see that the frames are not terribly thick, meaning they will not block a lot of the airflow.
I find the CTE C750 TG ARGB Snow has good build quality, which is not a surprise given the build quality we have come to expect from cases by Thermaltake. The steel and plastic material making up the case is very solid and does not feel cheap in any way. The surface and edges feel smooth on the fingers. The side panels fit very well and are tightly held in position by the ball-joints. The power and reset switches also have a crisp click when pressed. I think Thermaltake did a great job with the outside build.
Page Index
1. Introduction, Packaging, Specifications
2. Physical Look - Outside
3. Physical Look - Inside
4. Installation and Conclusion
