From Tom's Hardware: Intel's processors in LGA1700 packaging have faced serious criticism for bending and, therefore, insufficient cooling in some cases. With its Core Ultra 200S (codenamed Arrow Lake) processors in LGA1851 packaging, Intel not only moved the CPU hotspot north but also adopted a different integrated lever mechanism that improves compatibility with liquid coolers to lower thermals and uses a flat load plate, according to an MSI webcast.
"Intel adopts the new RL-ILM for Intel Core Ultra Processors," a statement by MSI reads. "The new ILM reduces loading force and ensures the liquid cooling fits more securely on the CPU surface, improving heat dissipation efficiency and reduce the CPU temperature about 1-2 degrees."
The new socket for LGA1851 processors uses a new RL-ILM, or integrated lever mechanism, the metallic bracket that holds the CPU in the socket. While the new IRL is not dramatically different from the one used with LGA1700 sockets and does not prevent the installation of previous-generation cooling systems (well, at least some of them), it has a lower loading force (which will reduce the chances of damaging Arrow Lake and other CPUs).
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