Page 3 - Physical Look - Inside
As always, we opened up our XPG Core Reactor II 1200W power supply to take a detailed look at what is going on inside. Please note that doing this at home will void your 10-year warranty, thanks to the warranty seal XPG applied over one of the attachment screws. It is great it comes with a 10-year warranty, which is the industry standard for performance PSUs. For the benefit of you, we cracked ours open, so you do not need to. There are no user serviceable parts inside.
Opening the XPG Core Reactor II 1200W is quite straightforward with the removal of nine screws. Taking out the internal components from the enclosure requires the removal of more. Our photo above shows an overhead view of its internal components. Its OEM is Channel Well Technology or CWT, a reputable OEM since 1993. It features an LLC half bridge topology with DC-to-DC converters. At first glance, the build quality appears to be excellent. There are three main heatsinks inside and almost no wires. All of them are located on the primary side and are painted black. It appears to be built on the same platform as the Thermaltake Toughpower GF3 1000W and DeepCool PX1000G 1000W.
Pulling the enclosure apart and we got straight to the internal inspection. The transient filter stage is the first input stage of a computer power supply, so we will take a look at that first. XPG has always done a great job in the past to make sure their higher end power supplies met or exceeded the recommended requirements, and the Core Reactor II 1200W is no exception. The XPG Core Reactor II 1200W has one metal oxide varistor, two metalized polyester X-capacitors, four ceramic Y-capacitors, and two common mode chokes. This is two times the amount of X and Y capacitors than recommended. Considering some PSUs have missing MOVs, I am happy to see it here as this component is used to stabilize spikes from the AC line.
The active PFC circuit featured on the XPG Core Reactor II 1200W uses two WeEn Semiconductors WNB2560M bridge rectifiers on both sides of the smallest heatsink. At 115V, the maximum rectified forward current capacity with heatsink is 25A each, so you can theoretically pull up to 5750W (25A * 2 diodes * 115V) from the bridge rectifier at 100% efficiency. Of course, this is limited by the fact that it is not 100% efficient and also neglects the fact that not every component in the system is able to keep up.
Further down the line, we can see three Alpha & Omega AOTF095A60L power MOSFETs for the active PFC circuit; both on the same side of the heatsink closest to the bulk capacitor. Each is rated for up to 24A at 100c. These transistors present a maximum resistance of 82 mΩ and typical resistance of 95 mΩ when turned on according to the manufacturer's data sheet. This on characteristic is called Static Drain-Source On-Resistance, or commonly abbreviated as RDS(on). The more efficient the component is, the lower the RDS(on) value, since it wastes less power with lower resistance.
On the same heatsink, there is one Cree C3D12065A silicon carbide Schottky diode as the APFC boost diode attached to it. Meanwhile, on the remaining heatsink, there are two Infineon IPA60R099P6 power transistors attached to it. Each is certified for up to 24A at 100c. These transistors present a maximum resistance of 99 mΩ and typical resistance of 89 mΩ when turned on according to the manufacturer's data sheet.
Champion's CU6901VAC is the switching controller, located on the back of the mainboard. The Champion CM6500UNX and Sync Power SPN5003 are part of the APFC controller circuit, located on a vertical PCB between the heatsinks.
On the primary side, we can see two Japanese-made Rubycon capacitors. 100% Japanese made capacitors are specified on the marketing material, so this is to be expected. Our 1200W version of XPG's latest Core Reactor II series power supply incorporates two capacitors, one 820µF x 400V and one 470µF x 400V, in parallel for a total of 1290µF capacitance. They are rated at 105c, whereas more value-oriented power supplies usually use 85c rated capacitors.
On the secondary side, we can see more Japanese-made electrolytic capacitors from Nippon Chemi-Con and Rubycon rated at 105c. As with modern high efficiency power supplies, all rectifiers produce the +12V out, while the +5V and +3.3V outputs are generated from the +12V output using a DC-to-DC converter within the power supply unit. Ten Infineon BSC014N06NS MOSFETs are responsible for generating the +12V output, located on an add-in board immediately after the transformer. The BSC014N06NS's rated continuous drain current is 152A at 100c. It has an RDS(on) value of 1.45 mΩ maximum and 1.2 mΩ typical at 10V.
The +5V and +3.3V outputs are generated by two UBIQ Semiconductor QN3107M6N and two UBIQ Semiconductor QM3054M6 MOSFETs on another add-in board, shown in the above photo. Each QN3107M6N is certified for up to 22A at 25c. These transistors present a maximum resistance of 2.6 mΩ and typical resistance of 2.1 mΩ at 10V when turned on according to the manufacturer's data sheet. Each QM3054M6 is certified for up to 16.6A at 25c with a maximum resistance of 4.8 mΩ and typical resistance of 3.8 mΩ at 10V when turned on.
uPI Semi's uP3861P is the PWM controller, located on the same add-in board as the DC-to-DC converter chips. Meanwhile, a Weltrend WT7502R monitoring IC, located on a vertical PCB next to the secondary stage components, provides over/under current and over/under voltage protection. The Microchip PIC16F1503 fan controller is located on the same vertical PCB. The datasheets for all components mentioned in this review can be found on their respective manufacturers' websites.
At the back, we have a large daughterboard covering the majority of the rear panel for the modular cable sockets. All modular sockets at the bottom are soldered directly to the main PCB after the secondary stage. Pin headers join the mainboard and daughterboard to reduce power transmission loss. The output connector configuration can be seen on the previous page. Overall, the internal build quality of XPG's Core Reactor II 1200W power supply is very good -- something we would expect from a CWT-built unit. Components are arranged very well for optimal cooling with almost no wires running around inside, and solder points on its black/green PCB is quite clean in general. I would say the XPG Core Reactor II 1200W is generally very good with regards to the selection of components used under the hood.
Lastly, we see a 135mm fan that provides cooling to the XPG Core Reactor II 1200W's internal components. It is connected to an add-in board using a 3-pin connector. A 135mm fan is about the largest you can fit in a power supply with a bottom mounted fan, and if not a lot of heat is being generated, noise will be kept to a minimum.
The model of the fan is Hong Hua HA13525H12SF-Z, as shown in our photo above. The HA13525H12SF-Z is a fluid dynamic bearing fan specified at 0.50A for a maximum speed of 2300 RPM. The fan is not supposed to activate until the PSU is loaded to approximately 480W, and is capped at 1800RPM by the manufacturer. As such, it should remain off for the most part, and even when it is on, the fan speed will vary with load. Fans with fluid dynamic bearings generally have much longer lifespans compared to sleeve bearing fans, and are quite suitable for this application.
1. Introduction, Packaging, Specifications
2. Physical Look - Outside
3. Physical Look - Inside
4. Minor Tests and Conclusion