Page 11 - Thermal Measurements and Overclocking
The ASUS ProArt Z890-Creator WiFi has two beefy heatsinks over the 16+1+2+2 90A team power stage design along with a passive heatsink over the Z890 chipset. The Z890 chipset is rated at 6W TDP, which does not require active cooling.
For this test, I put the system under full load using Prime95 and used an Etekcity Lasergrip 800 infrared thermometer to measure the surface temperature of key areas of the motherboard after 30 minutes. The surface temperature of both VRM heatsinks came in between 40.8c and 42.4c, while the chipset heatsink measured only 42.2c even without the large M.2 Q-Release heatsink. I have not experienced any stability problems caused by heat while using this motherboard. I further scanned the surface of the entire motherboard using the infrared thermometer and there were no areas of concern on the ProArt Z890-Creator WiFi.
Page Index
1. Introduction, Packaging, Specifications
2. Bundle and Chipset
3. Physical Look - Hardware, Board Layout
4. BIOS, Overclocking Features, Test System
5. Benchmark: AIDA64
6. Benchmark: Cinebench 2024
7. Benchmark: PassMark PerformanceTest 11
8. Benchmark: PCMark 10
9. Benchmark: 3DMark
10. Onboard Sound Frequency Analysis
11. Thermal Measurements
12. Conclusion
