Page 2 - A Closer Look, Test System
The Crucial Pro DDR5-5600 does not look like your typical OEM memory, as it comes with a heatspreader. However, you will see this metal plate barely adds any extra height to the memory modules. On the sides, the aluminum has a few styling edges that protrude out. The sides have the Crucial branding printed on one side and the name "DDR5 Pro" on the other. The top of heatsink has the line "Crucial DDR5 Pro" printed.
The metal heatsink is quite thin and serves as a decent heat conductor. Technically, it does increase the height of the Crucial Pro DDR5-5600 by about 1mm compared to modules with no heatspreader at all, but this is inconsequential when it comes to dealing with clearance. While extra aluminum on the side may or may not affect the performance, only OEM-grade memory seems to have no heatspreader attached nowadays. They do serve a purpose in dissipating heat while also having an added benefit of making the memory more pleasing to the eyes.
The Crucial Pro DDR5-5600 modules are symmetrically designed. The two metal pieces, one on each side, are not attached to each other, but rather affixed to the memory chips on the modules themselves. One side has a tab while the other side has an indent to make it look like they fit together, but nothing holds them together. Otherwise, both sides show off the company logo, and one side has a specifications sticker. It lists the model number, voltage, and some certification logos. These modules are assembled in Mexico.
The two aluminum sides are held together with strips of thermal conductive adhesive over the chips. This adhesion force between the heatspreaders and memory ICs is strong, but I was able to remove it using a heat source to slowly loosen the grip of the tape. You will likely never remove the heatspreaders, especially as these metal sides do not add any height to negatively affect the clearance of the memory. From the photo above, you can see the single module with a black PCB. The power management integrated circuit, also known as a PMIC, is in the middle of each module. A thermal pad can be found sandwiched between the metal heatspreader and the PMIC area to provide some cooling to this area. Four memory chips can be found to the left and right of the PMIC. All the components can be found on one side of the module.
With a closer look at the surface components, we have two primary things to look at. First is the PMIC, which is labelled MPPU5431K01. Unfortunately, I could not identify the manufacturer. Next, we have a closer look at one of the eight memory chips. These are Micron-manufactured with a "D8DDZ" FBGA inscription on each IC. Its full part number is MT60B2G8HB-56B:G, and these are 2GB chips for a total of 16GB on each DIMM. As mentioned on the previous page, the RAM modules run at DDR5-5600 with 46-45-45-90 latencies. They operate at the base DDR5 voltage of 1.1V, which is well under the recommended safe limit of 1.35V defined by both Intel and AMD. Below are the listed features for the ICs from Micron's website:
• VDD = VDDQ = 1.1V (NOM)
• VPP= 1.8V (NOM)
• On-die, internal, adjustable VREF generation for DQ, CA, CS
• 1.1V pseudo open-drain I/O
• TC maximum up to 95°C
– 32ms, 8192-cycle refresh up to 85°C
– 16ms, 8192-cycle refresh at >85°C to 95°C
• 32 internal banks (x4, x8): 8 groups of 4 banks each
• 16 internal banks (x16): 4 groups of 4 banks each
• 16n-bit prefetch architecture
• 1 cycle/2 cycle command structure
• 2N mode
• All bank and same bank refresh
• Multi-purpose command (MPC)
• CS/CA training mode
• On-die ECC (bounded fault)
• ECC transparency and error scrub
• Decision feedback equalization (DFE)
• Loopback mode
• Command-based non-target (NT) nominal, DQ/DQS park, and dynamic WR on-die termination (ODT)
• sPPR and hPPR capability
• Per-DRAM addressability
• JEDEC JESD-79.5 compliant
Our test configuration is as follows:
CPU: Intel Core i5-12600K
CPU Cooling: Cooler Master MasterLiquid 240L Core ARGB
Motherboard: ASUS ProArt Z690-Creator WiFi
Graphics: EVGA GeForce RTX 3070 Ti XC3 ULTRA GAMING
Chassis: Thermaltake Core P3 TG Pro Snow
Storage: XPG Atom 30 1TB
Power: FSP Hydro PTM Pro 1200W
Operating System: Microsoft Windows 11 Pro
Compared Hardware:
- Crucial Pro DDR5-5600 2x16GB @ DDR5-5600 46-45-45-90
- Crucial CT2K16G48C40U5 DDR5-4800 2x16GB @ DDR5-4800 40-39-39-77
- Crucial CT2K16G52C42U5 DDR5-5200 2x16GB @ DDR5-5200 42-42-42-84
- Crucial CT2K16G56C46U5 DDR5-5600 2x16GB @ DDR5-5600 46-45-45-90
- Kingston FURY Beast DDR5-5200 2x16GB @ DDR5-5200 40-40-40-80
- Kingston FURY Renegade RGB DDR5-6000 2x16GB @ DDR5-6000 32-38-38-80
- Lexar ARES RGB DDR5-6000 2x16GB @ DDR5-6000 34-38-38-76
- Patriot Viper Venom RGB DDR5-6200 2x16GB @ DDR5-6200 40-40-40-76
- XPG Lancer RGB DDR5-6000 2x16GB @ DDR5-6000 40-40-40-76
Page Index
1. Introduction, Packaging, Specifications
2. A Closer Look, Test System
3. Benchmark: AIDA64 CPU
4. Benchmark: AIDA64 FPU
5. Benchmark: AIDA64 Memory
6. Benchmark: PCMark 10
7. Benchmark: 3DMark
8. Benchmark: PassMark PerformanceTest 10
9. Benchmark: SuperPI 1M, Cinebench R23
10. Overclocking and Conclusion
